Intel unveils silicon wafer manufactured on a 22nm process

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Intel unveils silicon wafer manufactured on a 22nm process
The IDF (Intel Developer Forum) is a stage for Intel to demonstrate its upcoming technology. In amongst the orgy of power of certain demonstrations, it is the new smaller process that attracts our attention. Along with leaks of Core i3 at 32nm, Intel showed a silicon wafer manufactured on a 22nm process.


This 30cm diameter cake has the following characteristics:
  • 22nm
  • 364Mbit storage
  • 2.9 billion transistors

Intel is not lagging, the future for CPUs looks good!


Source : Inpai